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Metrology for monitoring and detecting process issues in a TSV module

dc.contributor.authorPhilipsen, Harold
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorCockburn, Andrew
dc.contributor.authorErickson, David
dc.contributor.authorDrijbooms, Chris
dc.contributor.authorMoussa, Alain
dc.contributor.authorBender, Hugo
dc.contributor.authorStruyf, Herbert
dc.date.accessioned2021-10-22T04:44:20Z
dc.date.available2021-10-22T04:44:20Z
dc.date.issued2014
dc.identifier.issn2162-8769
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24384
dc.sourceIIOimport
dc.titleMetrology for monitoring and detecting process issues in a TSV module
dc.typeJournal article
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.imecauthorDrijbooms, Chris
dc.contributor.imecauthorMoussa, Alain
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.source.peerreviewyes
dc.source.beginpageQ109
dc.source.endpageQ119
dc.source.journalECS Journal of Solid State Science and Technology
dc.source.issue6
dc.source.volume3
dc.identifier.urlhttp://jss.ecsdl.org/content/3/6/Q109.figures-only?related-urls=yes&legid=jss;3/6/Q109
imec.availabilityPublished - imec


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