dc.contributor.author | Radisic, Alex | |
dc.contributor.author | Vereecken, Philippe | |
dc.date.accessioned | 2021-10-22T04:56:47Z | |
dc.date.available | 2021-10-22T04:56:47Z | |
dc.date.issued | 2014 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/24412 | |
dc.source | IIOimport | |
dc.title | Direct copper plating | |
dc.type | Book chapter | |
dc.contributor.imecauthor | Radisic, Alex | |
dc.contributor.imecauthor | Vereecken, Philippe | |
dc.contributor.orcidimec | Vereecken, Philippe::0000-0003-4115-0075 | |
dc.source.peerreview | no | |
dc.source.beginpage | 131 | |
dc.source.book | Copper Electrodeposition for Nanofabrication of Electronics Devices | |
dc.source.endpage | 173 | |
dc.identifier.url | http://rd.springer.com/book/10.1007%2F978-1-4614-9176-7 | |
imec.availability | Published - imec | |
imec.internalnotes | ISBN: 978-1-4614-9175-0 (Print) 978-1-4614-9176-7 (Online) | |