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Thermal modelling of polymer stud grid array (PSGA) package

dc.contributor.authorChristiaens, Filip
dc.contributor.authorBeyne, Eric
dc.contributor.authorVandevelde, Bart
dc.contributor.authorRoggen, Jean
dc.contributor.authorMertens, Robert
dc.contributor.authorVan Puymbroeck, Jan
dc.contributor.authorHeerman, M.
dc.contributor.authorBergmans, J.
dc.date.accessioned2021-09-30T11:34:17Z
dc.date.available2021-09-30T11:34:17Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2447
dc.sourceIIOimport
dc.titleThermal modelling of polymer stud grid array (PSGA) package
dc.typeJournal article
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorMertens, Robert
dc.contributor.imecauthorVan Puymbroeck, Jan
dc.source.peerreviewno
dc.source.beginpage521
dc.source.endpage532
dc.source.journalIMAPS International Journal of Microcircuits and Electronic Packaging
dc.source.issue4
dc.source.volume20
imec.availabilityPublished - imec


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