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Probing 25μm-diameter micro-bumps for Wide-I/O 3D SICs

dc.contributor.authorSmith, Ken
dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2021-10-22T06:00:52Z
dc.date.available2021-10-22T06:00:52Z
dc.date.issued2014
dc.identifier.issn1526-1344
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24546
dc.sourceIIOimport
dc.titleProbing 25μm-diameter micro-bumps for Wide-I/O 3D SICs
dc.typeJournal article
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewno
dc.source.beginpage20
dc.source.endpage23
dc.source.journalChip Scale Review
dc.source.issue1
dc.source.volume18
dc.identifier.urlhttp://www.chipscalereview.com/issues/0114/index.php
imec.availabilityPublished - imec


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