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Scalability of RuTiN barriers deposited by plasma-enhanced atomic layer deposition for advanced interconnects

dc.contributor.authorSwerts, Johan
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorVan Besien, Els
dc.contributor.authorBarbarin, Yohan
dc.contributor.authorOpsomer, Karl
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.authorVan Elshocht, Sven
dc.date.accessioned2021-10-22T06:17:35Z
dc.date.available2021-10-22T06:17:35Z
dc.date.issued2014
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24581
dc.sourceIIOimport
dc.titleScalability of RuTiN barriers deposited by plasma-enhanced atomic layer deposition for advanced interconnects
dc.typeJournal article
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorVan Besien, Els
dc.contributor.imecauthorOpsomer, Karl
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.orcidimecVan Besien, Els::0000-0002-5174-2229
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage235
dc.source.endpage239
dc.source.journalMicroelectronic Engineering
dc.source.volume120
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0167931713005911
imec.availabilityPublished - open access


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