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3D-COSTAR for 2.5D and 3D stacked IC cost optimization

dc.contributor.authorTaouil, Mottaqiallah
dc.contributor.authorHamdioui, Said
dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2021-10-22T06:27:42Z
dc.date.available2021-10-22T06:27:42Z
dc.date.issued2014-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24602
dc.sourceIIOimport
dc.title3D-COSTAR for 2.5D and 3D stacked IC cost optimization
dc.typeBook chapter
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewno
dc.source.book3D Design Guide (released at RTI 3D-ASIP Conference)
imec.availabilityPublished - imec


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