dc.contributor.author | Cosemans, P. | |
dc.contributor.author | D'Haen, Jan | |
dc.contributor.author | Witvrouw, Ann | |
dc.contributor.author | Proost, Joris | |
dc.contributor.author | D'Olieslaeger, Marc | |
dc.contributor.author | De Ceuninck, Ward | |
dc.contributor.author | Maex, Karen | |
dc.contributor.author | De Schepper, Luc | |
dc.date.accessioned | 2021-09-30T11:36:53Z | |
dc.date.available | 2021-09-30T11:36:53Z | |
dc.date.issued | 1998 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/2464 | |
dc.source | IIOimport | |
dc.title | Study of Cu diffusion in an Al-1%Si-0.5%Cu bond pad with an Al-1%Si bond wire attached using scanning electron microscopy | |
dc.type | Journal article | |
dc.contributor.imecauthor | D'Haen, Jan | |
dc.contributor.imecauthor | D'Olieslaeger, Marc | |
dc.contributor.imecauthor | De Ceuninck, Ward | |
dc.contributor.imecauthor | Maex, Karen | |
dc.source.peerreview | no | |
dc.source.beginpage | 309 | |
dc.source.endpage | 315 | |
dc.source.journal | Microelectronics Reliability | |
dc.source.issue | 3 | |
dc.source.volume | 38 | |
imec.availability | Published - imec | |