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dc.contributor.authorVakanas, George
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorSchaubroeck, David
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorWillems, Geert
dc.contributor.authorAshworth, Mark A.
dc.contributor.authorWilcox, Geoffrey D.
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-22T06:54:27Z
dc.date.available2021-10-22T06:54:27Z
dc.date.issued2014
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24656
dc.sourceIIOimport
dc.titleSn whisker evaluations in 3D microbumped structures
dc.typeJournal article
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorSchaubroeck, David
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorWillems, Geert
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage1982
dc.source.endpage1987
dc.source.journalMicroelectronics Reliability
dc.source.issue9_10
dc.source.volume54
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271414003060
imec.availabilityPublished - imec
imec.internalnotesSpecial issue: 25th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - ESREF; Berlin


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