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Photonic flash soldering of thin chips and SMD components on foils for flexible electronics

dc.contributor.authorvan den Ende, Daan
dc.contributor.authorHendriks, Rob
dc.contributor.authorCauchois, Romain
dc.contributor.authorKusters, Roel H.L.
dc.contributor.authorCauwe, Maarten
dc.contributor.authorGroen, Wilhelm
dc.contributor.authorvan den Brand, Jeroen
dc.date.accessioned2021-10-22T07:01:33Z
dc.date.available2021-10-22T07:01:33Z
dc.date.issued2014
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24670
dc.sourceIIOimport
dc.titlePhotonic flash soldering of thin chips and SMD components on foils for flexible electronics
dc.typeJournal article
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1879
dc.source.endpage1886
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.issue11
dc.source.volume4
dc.identifier.urlhttp://ieeexplore.ieee.org/document/6923428/
imec.availabilityPublished - open access


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