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Mechanical and electrical propeties of ultra-thin chips and flexible electronics assemblies during bending

dc.contributor.authorvan den Ende, Daan
dc.contributor.authorvan de Wiel, H.J.
dc.contributor.authorKusters, Roel
dc.contributor.authorSridhar, Ashok
dc.contributor.authorSchram, Jeroen
dc.contributor.authorCauwe, Maarten
dc.contributor.authorvan den Brand, Jeroen
dc.date.accessioned2021-10-22T07:02:02Z
dc.date.available2021-10-22T07:02:02Z
dc.date.issued2014
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24671
dc.sourceIIOimport
dc.titleMechanical and electrical propeties of ultra-thin chips and flexible electronics assemblies during bending
dc.typeJournal article
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage2860
dc.source.endpage2870
dc.source.journalMicroelectronics Reliability
dc.source.issue12
dc.source.volume54
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271414003278
imec.availabilityPublished - open access


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