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In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures

dc.contributor.authorVanstreels, Kris
dc.contributor.authorCzarnecki, Piotr
dc.contributor.authorKirimura, Tomoyuki
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-22T07:38:33Z
dc.date.available2021-10-22T07:38:33Z
dc.date.issued2014
dc.identifier.issn0021-8979
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24746
dc.sourceIIOimport
dc.titleIn-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures
dc.typeJournal article
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorCzarnecki, Piotr
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecCzarnecki, Piotr::0000-0002-3648-3046
dc.contributor.orcidimecBoemmels, Juergen::0000-0002-8761-5213
dc.source.peerreviewyes
dc.source.beginpage74305
dc.source.journalJournal of Applied Physics
dc.source.issue7
dc.source.volume115
dc.identifier.urlhttp://scitation.aip.org/content/aip/journal/jap/115/7/10.1063/1.4866330
imec.availabilityPublished - imec


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