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Ultimate nano-electronics: new material and device concepts for scaling nano-electronics beyond the Si roadmap

dc.contributor.authorCollaert, Nadine
dc.contributor.authorAlian, AliReza
dc.contributor.authorArimura, Hiroaki
dc.contributor.authorBoccardi, Guillaume
dc.contributor.authorEneman, Geert
dc.contributor.authorFranco, Jacopo
dc.contributor.authorIvanov, Tsvetan
dc.contributor.authorLin, Dennis
dc.contributor.authorLoo, Roger
dc.contributor.authorMerckling, Clement
dc.contributor.authorMitard, Jerome
dc.contributor.authorPourghaderi, Mohammad Ali
dc.contributor.authorRooyackers, Rita
dc.contributor.authorSioncke, Sonja
dc.contributor.authorSun, Jianwu
dc.contributor.authorVandooren, Anne
dc.contributor.authorVeloso, Anabela
dc.contributor.authorVerhulst, Anne
dc.contributor.authorWaldron, Niamh
dc.contributor.authorWitters, Liesbeth
dc.contributor.authorZhou, Daisy
dc.contributor.authorBarla, Kathy
dc.contributor.authorThean, Aaron
dc.date.accessioned2021-10-22T18:43:49Z
dc.date.available2021-10-22T18:43:49Z
dc.date.issued2015
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25093
dc.sourceIIOimport
dc.titleUltimate nano-electronics: new material and device concepts for scaling nano-electronics beyond the Si roadmap
dc.typeJournal article
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorAlian, AliReza
dc.contributor.imecauthorArimura, Hiroaki
dc.contributor.imecauthorBoccardi, Guillaume
dc.contributor.imecauthorEneman, Geert
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorIvanov, Tsvetan
dc.contributor.imecauthorLin, Dennis
dc.contributor.imecauthorLoo, Roger
dc.contributor.imecauthorMerckling, Clement
dc.contributor.imecauthorMitard, Jerome
dc.contributor.imecauthorVandooren, Anne
dc.contributor.imecauthorVeloso, Anabela
dc.contributor.imecauthorVerhulst, Anne
dc.contributor.imecauthorWaldron, Niamh
dc.contributor.imecauthorWitters, Liesbeth
dc.contributor.imecauthorZhou, Daisy
dc.contributor.imecauthorBarla, Kathy
dc.contributor.imecauthorThean, Aaron
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.contributor.orcidimecBoccardi, Guillaume::0000-0003-3226-4572
dc.contributor.orcidimecEneman, Geert::0000-0002-5849-3384
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecIvanov, Tsvetan::0000-0003-3407-2742
dc.contributor.orcidimecLoo, Roger::0000-0003-3513-6058
dc.contributor.orcidimecMerckling, Clement::0000-0003-3084-2543
dc.contributor.orcidimecMitard, Jerome::0000-0002-7422-079X
dc.contributor.orcidimecVandooren, Anne::0000-0002-2412-0176
dc.contributor.orcidimecVerhulst, Anne::0000-0002-3742-9017
dc.source.peerreviewyes
dc.source.beginpage218
dc.source.endpage225
dc.source.journalMicroelectronic Engineering
dc.source.volume132
dc.identifier.urlhttp://dx.doi.org/10.1016/j.mee.2014.08.005
imec.availabilityPublished - imec


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