The influence of plasma processes on EUV pattern roughness mitigation for future CMOS technologies
dc.contributor.author | De Schepper, Peter | |
dc.date.accessioned | 2021-10-22T18:51:54Z | |
dc.date.available | 2021-10-22T18:51:54Z | |
dc.date.issued | 2015-04 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/25149 | |
dc.source | IIOimport | |
dc.title | The influence of plasma processes on EUV pattern roughness mitigation for future CMOS technologies | |
dc.type | PHD thesis | |
dc.contributor.imecauthor | De Schepper, Peter | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.contributor.thesisadvisor | De Gendt, Stefan | |
imec.availability | Published - open access |