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Pattern roughness mitigation of 22 nm lines and spaces: The impact of H2 plasma treatment

dc.contributor.authorDe Schepper, Peter
dc.contributor.authorVaglio Pret, Alessandro
dc.contributor.authorEl Otell, Ziad
dc.contributor.authorHansen, Terje
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.authorDe Gendt, Stefan
dc.date.accessioned2021-10-22T18:52:23Z
dc.date.available2021-10-22T18:52:23Z
dc.date.issued2015
dc.identifier.issn1612-8850
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25152
dc.sourceIIOimport
dc.titlePattern roughness mitigation of 22 nm lines and spaces: The impact of H2 plasma treatment
dc.typeJournal article
dc.contributor.imecauthorDe Schepper, Peter
dc.contributor.imecauthorVaglio Pret, Alessandro
dc.contributor.imecauthorEl Otell, Ziad
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage153
dc.source.endpage161
dc.source.journalPlasma Processes and Polymers
dc.source.issue2
dc.source.volume12
dc.identifier.urlhttp://onlinelibrary.wiley.com/doi/10.1002/ppap.201400078/abstract
imec.availabilityPublished - open access


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