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Role of bath composition in electroless Cu seeding on Co liner for through-Si vias

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorArmini, Silvia
dc.contributor.authorStruyf, Herbert
dc.contributor.authorTanaka, Tetsu
dc.date.accessioned2021-10-22T19:51:08Z
dc.date.available2021-10-22T19:51:08Z
dc.date.issued2015-01
dc.identifier.issn2162-8769
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25416
dc.sourceIIOimport
dc.titleRole of bath composition in electroless Cu seeding on Co liner for through-Si vias
dc.typeJournal article
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.beginpageN3108
dc.source.endpageN3112
dc.source.journalECS Journal of Solid State Science and Technology
dc.source.issue1
dc.source.volume4
dc.identifier.urlhttp://dx.doi.org/10.1149/2.0131501jss
imec.availabilityPublished - imec


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