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dc.contributor.authorNabiollahi, Nabi
dc.contributor.authorMoelans, Nele
dc.contributor.authorGonzalez, Mario
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorWilson, Chris
dc.contributor.authorCroes, Kristof
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-22T21:18:15Z
dc.date.available2021-10-22T21:18:15Z
dc.date.issued2015
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25679
dc.sourceIIOimport
dc.titleMicrostructure simulation of grain growth in Cu through silicon vias using phase-field modeling
dc.typeJournal article
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage765
dc.source.endpage770
dc.source.journalMicroelectronics Reliability
dc.source.issue5
dc.source.volume55
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271415000293
imec.availabilityPublished - imec


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