Show simple item record

Post-ion beam induced degradation of copper layers in transmission electron microscopy specimens

dc.contributor.authorSeidel, Felix
dc.contributor.authorRichard, Olivier
dc.contributor.authorBender, Hugo
dc.contributor.authorVandervorst, Wilfried
dc.date.accessioned2021-10-22T22:42:45Z
dc.date.available2021-10-22T22:42:45Z
dc.date.issued2015
dc.identifier.issn0268-1242
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25884
dc.sourceIIOimport
dc.titlePost-ion beam induced degradation of copper layers in transmission electron microscopy specimens
dc.typeJournal article
dc.contributor.imecauthorSeidel, Felix
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage114016
dc.source.journalSemiconductor Science and Technology
dc.source.issue11
dc.source.volume30
dc.identifier.urlhttp://iopscience.iop.org/article/10.1088/0268-1242/30/11/114016/meta
imec.availabilityPublished - open access
imec.internalnotesMicroscopy of Semiconducting Materials - MSM XIX 2015


Files in this item

Thumbnail
Name:
31290.pdf
Size:
1.687Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record