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Thermal expansion coefficients of ultralow-k dielectric films by cube corner indentation tests at elevated temperatures

dc.contributor.authorVanstreels, Kris
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorHangen, Ude
dc.date.accessioned2021-10-23T00:29:34Z
dc.date.available2021-10-23T00:29:34Z
dc.date.issued2015
dc.identifier.issn0003-6951
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26114
dc.sourceIIOimport
dc.titleThermal expansion coefficients of ultralow-k dielectric films by cube corner indentation tests at elevated temperatures
dc.typeJournal article
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.source.peerreviewyes
dc.source.beginpage233101
dc.source.journalApplied Physics Letters
dc.source.issue23
dc.source.volume107
dc.identifier.urlhttp://dx.doi.org/10.1063/1.4936996
imec.availabilityPublished - imec


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