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The 3-D interconnect technology landscape

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T10:06:58Z
dc.date.available2021-10-23T10:06:58Z
dc.date.issued2016
dc.identifier.issn2168-2355
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26337
dc.sourceIIOimport
dc.titleThe 3-D interconnect technology landscape
dc.typeJournal article
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage8
dc.source.endpage20
dc.source.journalIEEE Design & Test
dc.source.issue3
dc.source.volume33
dc.identifier.urlhttps://ieeexplore.ieee.org/document/7438817
imec.availabilityPublished - open access


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