| dc.contributor.author | Beyne, Eric | |
| dc.date.accessioned | 2021-10-23T10:07:02Z | |
| dc.date.available | 2021-10-23T10:07:02Z | |
| dc.date.issued | 2016 | |
| dc.identifier.issn | 2156-3950 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/26338 | |
| dc.source | IIOimport | |
| dc.title | Reliable via-middle copper through-silicon via technology for 3-D integration | |
| dc.type | Journal article | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.embargo | 9999-12-31 | |
| dc.source.peerreview | yes | |
| dc.source.beginpage | 983 | |
| dc.source.endpage | 992 | |
| dc.source.journal | IEEE Transactions on Components, Packaging and Manufacturing Technology | |
| dc.source.issue | 7 | |
| dc.source.volume | 6 | |
| dc.identifier.url | https://ieeexplore.ieee.org/document/7329969 | |
| imec.availability | Published - open access | |
