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Metal containing resist readiness for HVM EUV lithography

dc.contributor.authorDe Simone, Danilo
dc.contributor.authorMao, Ming
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorVandenberghe, Geert
dc.date.accessioned2021-10-23T10:28:23Z
dc.date.available2021-10-23T10:28:23Z
dc.date.issued2016
dc.identifier.issn0914-9244
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26512
dc.sourceIIOimport
dc.titleMetal containing resist readiness for HVM EUV lithography
dc.typeJournal article
dc.contributor.imecauthorDe Simone, Danilo
dc.contributor.imecauthorMao, Ming
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorVandenberghe, Geert
dc.contributor.orcidimecDe Simone, Danilo::0000-0003-3927-5207
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage504
dc.source.endpage507
dc.source.journalJournal of Photopolymer Science and Technology
dc.source.issue3
dc.source.volume29
dc.identifier.urlhttps://www.jstage.jst.go.jp/article/photopolymer/29/3/29_501/_article
imec.availabilityPublished - open access
imec.internalnotesPaper from the 33th International Conference of Photopolymer Science and Technology. June 2016. Chiba Japan


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