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Study of amorphous Cu-Te-Si thin films showing high thermal stability for application as a cation supply layer in conductive bridge random access memory devices

dc.contributor.authorDevulder, Wouter
dc.contributor.authorOpsomer, Karl
dc.contributor.authorMinjauw, Matthias
dc.contributor.authorMeersschaut, Johan
dc.contributor.authorJurczak, Gosia
dc.contributor.authorGoux, Ludovic
dc.contributor.authorDetavernier, Christophe
dc.date.accessioned2021-10-23T10:35:09Z
dc.date.available2021-10-23T10:35:09Z
dc.date.issued2016
dc.identifier.issn2046-2069
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26549
dc.sourceIIOimport
dc.titleStudy of amorphous Cu-Te-Si thin films showing high thermal stability for application as a cation supply layer in conductive bridge random access memory devices
dc.typeJournal article
dc.contributor.imecauthorDevulder, Wouter
dc.contributor.imecauthorOpsomer, Karl
dc.contributor.imecauthorMeersschaut, Johan
dc.contributor.imecauthorJurczak, Gosia
dc.contributor.imecauthorGoux, Ludovic
dc.contributor.orcidimecDevulder, Wouter::0000-0002-5156-0177
dc.contributor.orcidimecMeersschaut, Johan::0000-0003-2467-1784
dc.contributor.orcidimecGoux, Ludovic::0000-0002-1276-2278
dc.source.peerreviewyes
dc.source.beginpage32106
dc.source.endpage32114
dc.source.journalRSC Advances
dc.source.issue38
dc.source.volume6
dc.identifier.urlhttp://pubs.rsc.org/en/content/articlelanding/2016/RA/c6ra04064k#!divAbstract
imec.availabilityPublished - imec


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