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Fine pitch rapid heat self-aligned assembly and liquid-mediated direct bonding of Si cIEMCBEhips

dc.contributor.authorDubey, Vikas
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorBeyne, Eric
dc.contributor.authorCelis, Jean Pierre
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-23T10:41:54Z
dc.date.available2021-10-23T10:41:54Z
dc.date.issued2016
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26584
dc.sourceIIOimport
dc.titleFine pitch rapid heat self-aligned assembly and liquid-mediated direct bonding of Si cIEMCBEhips
dc.typeJournal article
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage946
dc.source.endpage953
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.issue6
dc.source.volume6
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7442100/
imec.availabilityPublished - open access


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