dc.contributor.author | Dubey, Vikas | |
dc.contributor.author | Derakhshandeh, Jaber | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Celis, Jean Pierre | |
dc.contributor.author | De Wolf, Ingrid | |
dc.date.accessioned | 2021-10-23T10:41:54Z | |
dc.date.available | 2021-10-23T10:41:54Z | |
dc.date.issued | 2016 | |
dc.identifier.issn | 2156-3950 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/26584 | |
dc.source | IIOimport | |
dc.title | Fine pitch rapid heat self-aligned assembly and liquid-mediated direct bonding of Si cIEMCBEhips | |
dc.type | Journal article | |
dc.contributor.imecauthor | Derakhshandeh, Jaber | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 946 | |
dc.source.endpage | 953 | |
dc.source.journal | IEEE Transactions on Components, Packaging and Manufacturing Technology | |
dc.source.issue | 6 | |
dc.source.volume | 6 | |
dc.identifier.url | http://ieeexplore.ieee.org/document/7442100/ | |
imec.availability | Published - open access | |