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Copper through silicon vias studied by the photo-elastic Scanning Infrared Microscope SIREX

dc.contributor.authorHerms, Martin
dc.contributor.authorWagner, M.
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-23T11:14:16Z
dc.date.available2021-10-23T11:14:16Z
dc.date.issued2016
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26718
dc.sourceIIOimport
dc.titleCopper through silicon vias studied by the photo-elastic Scanning Infrared Microscope SIREX
dc.typeJournal article
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage330
dc.source.endpage335
dc.source.journalMicroelectronics Reliability
dc.source.volume64
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271416301780
imec.availabilityPublished - imec
imec.internalnotesESREF conference 19-22 september 2016


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