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Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line

dc.contributor.authorKljucar, Luka
dc.contributor.authorGonzalez, Mario
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorCroes, Kristof
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-23T11:50:07Z
dc.date.available2021-10-23T11:50:07Z
dc.date.issued2016-01
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26837
dc.sourceIIOimport
dc.titleEvaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line
dc.typeJournal article
dc.contributor.imecauthorKljucar, Luka
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecBoemmels, Juergen::0000-0002-8761-5213
dc.identifier.doi10.1016/j.microrel.2015.11.012
dc.source.peerreviewyes
dc.source.beginpage93
dc.source.endpage100
dc.source.journalMicroelectronics Reliability
dc.source.volume56
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271415302274
imec.availabilityPublished - imec


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