dc.contributor.author | Waldron, Niamh | |
dc.contributor.author | Merckling, Clement | |
dc.contributor.author | Teugels, Lieve | |
dc.contributor.author | Ong, Patrick | |
dc.contributor.author | Sebaai, Farid | |
dc.contributor.author | Barla, Kathy | |
dc.contributor.author | Collaert, Nadine | |
dc.contributor.author | Thean, Aaron | |
dc.date.accessioned | 2021-10-23T16:58:20Z | |
dc.date.available | 2021-10-23T16:58:20Z | |
dc.date.issued | 2016 | |
dc.identifier.issn | 0038-1101 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/27563 | |
dc.source | IIOimport | |
dc.title | Replacement fin processing for III-V on Si: From FinFets to nanowires | |
dc.type | Journal article | |
dc.contributor.imecauthor | Waldron, Niamh | |
dc.contributor.imecauthor | Merckling, Clement | |
dc.contributor.imecauthor | Teugels, Lieve | |
dc.contributor.imecauthor | Ong, Patrick | |
dc.contributor.imecauthor | Sebaai, Farid | |
dc.contributor.imecauthor | Barla, Kathy | |
dc.contributor.imecauthor | Collaert, Nadine | |
dc.contributor.imecauthor | Thean, Aaron | |
dc.contributor.orcidimec | Merckling, Clement::0000-0003-3084-2543 | |
dc.contributor.orcidimec | Teugels, Lieve::0000-0002-6613-9414 | |
dc.contributor.orcidimec | Ong, Patrick::0000-0002-2072-292X | |
dc.contributor.orcidimec | Collaert, Nadine::0000-0002-8062-3165 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 81 | |
dc.source.endpage | 91 | |
dc.source.journal | Solid-State Electronics | |
dc.source.issue | Part B | |
dc.source.volume | 115 | |
dc.identifier.url | http://www.sciencedirect.com/science/article/pii/S0038110115002737 | |
imec.availability | Published - imec | |