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Airgaps in advanced nano-interconnects; mechanics and impact on electromigration

dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorBesser, Paul
dc.contributor.authorWilson, Chris
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-23T17:41:25Z
dc.date.available2021-10-23T17:41:25Z
dc.date.issued2016
dc.identifier.issn0021-8979
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27645
dc.sourceIIOimport
dc.titleAirgaps in advanced nano-interconnects; mechanics and impact on electromigration
dc.typeJournal article
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorBesser, Paul
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage95103
dc.source.journalJournal of Applied Physics
dc.source.issue9
dc.source.volume120
dc.identifier.urlhttp://scitation.aip.org/content/aip/journal/jap/120/9/10.1063/1.4961877
imec.availabilityPublished - imec


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