dc.contributor.author | Zahedmanesh, Houman | |
dc.contributor.author | Gonzalez, Mario | |
dc.contributor.author | Ciofi, Ivan | |
dc.contributor.author | Croes, Kristof | |
dc.contributor.author | Boemmels, Juergen | |
dc.contributor.author | Tokei, Zsolt | |
dc.date.accessioned | 2021-10-23T17:41:57Z | |
dc.date.available | 2021-10-23T17:41:57Z | |
dc.date.issued | 2016 | |
dc.identifier.issn | 0167-9317 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/27646 | |
dc.source | IIOimport | |
dc.title | Stress analysis of airgaps under process-induced thermomechanical loads | |
dc.type | Journal article | |
dc.contributor.imecauthor | Zahedmanesh, Houman | |
dc.contributor.imecauthor | Gonzalez, Mario | |
dc.contributor.imecauthor | Ciofi, Ivan | |
dc.contributor.imecauthor | Croes, Kristof | |
dc.contributor.imecauthor | Boemmels, Juergen | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.orcidimec | Ciofi, Ivan::0000-0003-1374-4116 | |
dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 70 | |
dc.source.endpage | 77 | |
dc.source.journal | Microelectronic Engineering | |
dc.source.volume | 156 | |
dc.identifier.url | http://www.sciencedirect.com/science/article/pii/S0167931716300612 | |
imec.availability | Published - imec | |