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Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications

dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorRadisic, Alex
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorHonore, Mia
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorStruyf, Herbert
dc.contributor.authorArnold, Marco
dc.contributor.authorFluegel, Alexander
dc.contributor.authorMayer, Dieter
dc.contributor.authorShu-Ya Chang, Iris
dc.date.accessioned2021-10-24T04:34:49Z
dc.date.available2021-10-24T04:34:49Z
dc.date.issued2017
dc.identifier.issn1526-1344
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28304
dc.sourceIIOimport
dc.titleElectrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
dc.typeJournal article
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecEl-Mekki, Zaid::0000-0002-9851-9139
dc.contributor.orcidimecStruyf, Herbert::0000-0002-6782-5424
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage28
dc.source.endpage32
dc.source.journalChip Scale Review
dc.source.issue1
dc.source.volume21
dc.identifier.urlhttp://www.chipscalereview.com/issue/1702/ChipScale_Jan_Feb_2017.pdf
imec.availabilityPublished - imec
imec.internalnotesPaper from the 2016 International Wafer-Level Packaging Conference (IWLPC)


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