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Edge trimming for surface activated dielectric bonded wafers

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorJourdain, Anne
dc.contributor.authorVisker, Jakob
dc.contributor.authorPeng, Lan
dc.contributor.authorMoeller, Berthold
dc.contributor.authorYokoyama, Yokoyama
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorSleeckx, Erik
dc.date.accessioned2021-10-24T06:07:06Z
dc.date.available2021-10-24T06:07:06Z
dc.date.issued2017
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28565
dc.sourceIIOimport
dc.titleEdge trimming for surface activated dielectric bonded wafers
dc.typeJournal article
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVisker, Jakob
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.source.peerreviewyes
dc.source.beginpage10
dc.source.endpage16
dc.source.journalMicroelectronic Engineering
dc.source.volume167
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0167931716304488
imec.availabilityPublished - imec
imec.internalnotesSpecial issue MAM conference 2016


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