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Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices

dc.contributor.authorJacobs, Kristof J.P.
dc.contributor.authorWang, Teng
dc.contributor.authorStucchi, Michele
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-24T06:12:28Z
dc.date.available2021-10-24T06:12:28Z
dc.date.issued2017
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28579
dc.sourceIIOimport
dc.titleLock-in thermal laser stimulation for non-destructive failure localization in 3-D devices
dc.typeJournal article
dc.contributor.imecauthorJacobs, Kristof J.P.
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecJacobs, Kristof J.P.::0000-0002-1081-3633
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage188
dc.source.endpage193
dc.source.journalMicroelectronics Reliability
dc.source.volume76-77
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S0026271417302226
imec.availabilityPublished - imec
imec.internalnotesESREF 2017 paper


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