Show simple item record

Convolution-based fast thermal model for 3D-ICs: transient experimental validation

dc.contributor.authorMaggioni, Federica
dc.contributor.authorCherman, Vladimir
dc.contributor.authorOprins, Herman
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBaelmans, Martine
dc.date.accessioned2021-10-24T08:28:10Z
dc.date.available2021-10-24T08:28:10Z
dc.date.issued2017
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28883
dc.sourceIIOimport
dc.titleConvolution-based fast thermal model for 3D-ICs: transient experimental validation
dc.typeJournal article
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.identifier.doi10.1109/TCPMT.2016.2638829
dc.source.peerreviewyes
dc.source.beginpage221
dc.source.endpage228
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.issue2
dc.source.volume7
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7820154/
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record