Show simple item record

Broadband modeling and transient analysis of MCM interconnections

dc.contributor.authorPeeters, Joris
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-09-29T12:45:17Z
dc.date.available2021-09-29T12:45:17Z
dc.date.issued1994
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/293
dc.sourceIIOimport
dc.titleBroadband modeling and transient analysis of MCM interconnections
dc.typeJournal article
dc.contributor.imecauthorBeyne, Eric
dc.source.peerreviewno
dc.source.beginpage153
dc.source.endpage160
dc.source.journalIEEE Trans. Components, Packaging and Manufacturing Technology. Part B: Advanced Packaging
dc.source.issue2
dc.source.volume17
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record