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Dopant, composition and carrier profiling for 3D-structures

dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorFleischmann, Claudia
dc.contributor.authorBogdanowicz, Janusz
dc.contributor.authorCelano, Umberto
dc.contributor.authorParedis, Kristof
dc.contributor.authorBudrevich, A
dc.date.accessioned2021-10-24T16:59:01Z
dc.date.available2021-10-24T16:59:01Z
dc.date.issued2017
dc.identifier.issn1369-8001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29762
dc.sourceIIOimport
dc.titleDopant, composition and carrier profiling for 3D-structures
dc.typeJournal article
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorFleischmann, Claudia
dc.contributor.imecauthorBogdanowicz, Janusz
dc.contributor.imecauthorCelano, Umberto
dc.contributor.imecauthorParedis, Kristof
dc.contributor.orcidimecFleischmann, Claudia::0000-0003-1531-6916
dc.contributor.orcidimecBogdanowicz, Janusz::0000-0002-7503-8922
dc.contributor.orcidimecCelano, Umberto::0000-0002-2856-3847
dc.contributor.orcidimecParedis, Kristof::0000-0002-5163-4164
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage31
dc.source.endpage48
dc.source.journalMaterials Science in Semiconductor Processing
dc.source.volume62
dc.identifier.urlhttp://www.sciencedirect.com/science/article/pii/S1369800116304619
imec.availabilityPublished - open access


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