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Impact of organic linking and terminal groups on the mechanical properties of self-assembly based low-k dielectrics

dc.contributor.authorVanstreels, Kris
dc.contributor.authorKrishtab, Mikhail
dc.contributor.authorGarcia Gonzalez, Laura
dc.contributor.authorArmini, Silvia
dc.date.accessioned2021-10-24T17:18:55Z
dc.date.available2021-10-24T17:18:55Z
dc.date.issued2017
dc.identifier.issn0003-6951
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29793
dc.sourceIIOimport
dc.titleImpact of organic linking and terminal groups on the mechanical properties of self-assembly based low-k dielectrics
dc.typeJournal article
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorKrishtab, Mikhail
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.beginpage161906
dc.source.journalApplied Physics Letters
dc.source.issue16
dc.source.volume111
dc.identifier.urlhttp://aip.scitation.org/doi/full/10.1063/1.4993088
imec.availabilityPublished - imec


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