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Innovative solutions for advanced interconnects using ultralow-k dielectrics

dc.contributor.authorZhang, Liping
dc.date.accessioned2021-10-24T19:58:37Z
dc.date.available2021-10-24T19:58:37Z
dc.date.issued2017-02
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30019
dc.sourceIIOimport
dc.titleInnovative solutions for advanced interconnects using ultralow-k dielectrics
dc.typePHD thesis
dc.contributor.imecauthorZhang, Liping
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.contributor.thesisadvisorDe Gendt, Stefan
dc.contributor.thesisadvisorBaklanov, Mikhail R.
dc.identifier.urlhttps://limo.libis.be/primo-explore/fulldisplay?docid=LIRIAS1724076&context=L&vid=Lirias&search_scope=Lirias&tab=default_tab&lang=en_US&fromSitemap=1
imec.availabilityPublished - open access


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