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Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers

dc.contributor.authorBogan, Justin
dc.contributor.authorBrady-Boyd, Anita
dc.contributor.authorArmini, Silvia
dc.contributor.authorLundy, R.
dc.contributor.authorSelvaraju, V.
dc.contributor.authorO'Connor, Robert
dc.date.accessioned2021-10-25T16:48:51Z
dc.date.available2021-10-25T16:48:51Z
dc.date.issued2018
dc.identifier.issn0169-4332
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30279
dc.sourceIIOimport
dc.titleNucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers
dc.typeJournal article
dc.contributor.imecauthorBrady-Boyd, Anita
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecBrady-Boyd, Anita::0000-0002-9257-6837
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.beginpage38
dc.source.endpage47
dc.source.journalApplied Surface Science
dc.source.volume462
dc.identifier.urlhttps://doi.org/10.1016/j.apsusc.2018.08.029
imec.availabilityPublished - imec


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