Creating 1 $lm RDL structures for fan-out wafer-level packaging

dc.contributor.author	Flack, Warren
dc.contributor.author	Slabbekoorn, John
dc.date.accessioned	2021-10-25T18:39:59Z
dc.date.available	2021-10-25T18:39:59Z
dc.date.issued	2018
dc.identifier.issn	1526-1344
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/30710
dc.source	IIOimport
dc.title	Creating 1 $lm RDL structures for fan-out wafer-level packaging
dc.type	Journal article
dc.contributor.imecauthor	Slabbekoorn, John
dc.date.embargo	9999-12-31
dc.source.peerreview	no
dc.source.beginpage	7
dc.source.endpage	10
dc.source.journal	Chip Scale Review
dc.source.issue	3
dc.source.volume	22
dc.identifier.url	http://www.chipscalereview.com/issue2018.html
imec.availability	Published - open access