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Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly

dc.contributor.authorLofrano, Melina
dc.contributor.authorCherman, Vladimir
dc.contributor.authorGonzalez, Mario
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-25T22:23:54Z
dc.date.available2021-10-25T22:23:54Z
dc.date.issued2018
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31222
dc.sourceIIOimport
dc.titleEnhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly
dc.typeJournal article
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage97
dc.source.endpage105
dc.source.journalMicroelectronics Reliability
dc.source.volume87
dc.identifier.urlhttps://www.sciencedirect.com/science/article/pii/S0026271418303792
imec.availabilityPublished - imec


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