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Fast and distributed thermal model for thermal modeling of GaN power devices

dc.contributor.authorSodan, Vice
dc.contributor.authorStoffels, Steve
dc.contributor.authorOprins, Herman
dc.contributor.authorDecoutere, Stefaan
dc.contributor.authorAltmann, Frank
dc.contributor.authorBaelmans, Martine
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-26T04:20:08Z
dc.date.available2021-10-26T04:20:08Z
dc.date.issued2018-10
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31823
dc.sourceIIOimport
dc.titleFast and distributed thermal model for thermal modeling of GaN power devices
dc.typeJournal article
dc.contributor.imecauthorStoffels, Steve
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorDecoutere, Stefaan
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecDecoutere, Stefaan::0000-0001-6632-6239
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage1747
dc.source.endpage1755
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.issue10
dc.source.volume8
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8315476/
imec.availabilityPublished - imec


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