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Effects of oxygen and fluorine on the dry etch characteristics of organic low-k dielectrics

dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorBender, Hugo
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-06T10:41:39Z
dc.date.available2021-10-06T10:41:39Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3210
dc.sourceIIOimport
dc.titleEffects of oxygen and fluorine on the dry etch characteristics of organic low-k dielectrics
dc.typeJournal article
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.source.peerreviewno
dc.source.beginpage372
dc.source.endpage379
dc.source.journalJ. Vacuum Science and Technology B
dc.source.issue2
dc.source.volume17
imec.availabilityPublished - imec


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