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Methodology for solder-joint lifetime prediction of LED-based PCB assemblies

dc.contributor.authorVandevelde, Bart
dc.contributor.authorGriffoni, Alessio
dc.contributor.authorZanon, Franco
dc.contributor.authorWillems, Geert
dc.date.accessioned2021-10-26T07:46:40Z
dc.date.available2021-10-26T07:46:40Z
dc.date.issued2018
dc.identifier.issn1530-4388
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32134
dc.sourceIIOimport
dc.titleMethodology for solder-joint lifetime prediction of LED-based PCB assemblies
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage377
dc.source.endpage382
dc.source.journalIEEE Transactions on Device and Materials Reliability
dc.source.issue3
dc.source.volume18
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8390890
imec.availabilityPublished - open access


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