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dc.contributor.authorYang, Yang
dc.contributor.authorVervust, Thomas
dc.contributor.authorDunphy, Sheila
dc.contributor.authorVan Put, Steven
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorDhaenens, Kristof
dc.contributor.authorDegrendele, Lieven
dc.contributor.authorMader, Lothar
dc.contributor.authorDe Vriese, Linde
dc.contributor.authorMartens, Tom
dc.contributor.authorKaufmann, Markus
dc.contributor.authorSekitiani, Tsyoshi
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-26T10:08:33Z
dc.date.available2021-10-26T10:08:33Z
dc.date.issued2018
dc.identifier.issn2199-160X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32326
dc.sourceIIOimport
dc.title3D Multifunctional composites based on large-area stretchable circuit with thermoforming technology
dc.typeJournal article
dc.contributor.imecauthorVervust, Thomas
dc.contributor.imecauthorDunphy, Sheila
dc.contributor.imecauthorVan Put, Steven
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorDhaenens, Kristof
dc.contributor.imecauthorDegrendele, Lieven
dc.contributor.imecauthorMader, Lothar
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1800071
dc.source.journalAdvanced Electronic Materials
dc.source.issue8
dc.source.volume4
dc.identifier.urlhttps://doi.org/10.1002/aelm.201800071|
imec.availabilityPublished - open access


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