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Electromigration activation energies in alternative metal interconnects

dc.contributor.authorBeyne, Sofie
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorOprins, Herman
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorTokei, Zsolt
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-27T07:34:36Z
dc.date.available2021-10-27T07:34:36Z
dc.date.issued2019
dc.identifier.issn0018-9383
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32541
dc.sourceIIOimport
dc.titleElectromigration activation energies in alternative metal interconnects
dc.typeJournal article
dc.contributor.imecauthorBeyne, Sofie
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage5278
dc.source.endpage5283
dc.source.journalIEEE Transactions on Electron Devices
dc.source.issue12
dc.source.volume66
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8895754
imec.availabilityPublished - imec


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