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Two-step room temperature grain growth in electroplated copper

dc.contributor.authorBrongersma, Sywert
dc.contributor.authorRichard, Emmanuel
dc.contributor.authorVervoort, Iwan
dc.contributor.authorBender, Hugo
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorLagrange, Sébastien
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-06T10:46:13Z
dc.date.available2021-10-06T10:46:13Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3278
dc.sourceIIOimport
dc.titleTwo-step room temperature grain growth in electroplated copper
dc.typeJournal article
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.source.peerreviewno
dc.source.beginpage3642
dc.source.endpage3645
dc.source.journalJ. Appl. Phys.
dc.source.issue7
dc.source.volume86
imec.availabilityPublished - imec


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