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Copper rich Cu1-xNix alloys (0.05 < x < 0.15) electrodeposited from acid sulfate-based electrolyte with benzotriazole additive for microbump metallization for 3D stacked integrated circuits

dc.contributor.authorHaesevoets, Karel
dc.contributor.authorRadisic, Alex
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-27T09:56:43Z
dc.date.available2021-10-27T09:56:43Z
dc.date.issued2019
dc.identifier.issn0013-4651
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33079
dc.sourceIIOimport
dc.titleCopper rich Cu1-xNix alloys (0.05 < x < 0.15) electrodeposited from acid sulfate-based electrolyte with benzotriazole additive for microbump metallization for 3D stacked integrated circuits
dc.typeJournal article
dc.contributor.imecauthorHaesevoets, Karel
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewyes
dc.source.beginpageD315
dc.source.endpageD322
dc.source.journalJournal of the Electrochemical Society
dc.source.issue8
dc.source.volume166
dc.identifier.urlhttp://jes.ecsdl.org/lookup/doi/10.1149/2.0721908jes
imec.availabilityPublished - imec


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