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Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation

dc.contributor.authorHerfurth, Norbert
dc.contributor.authorWu, Chen
dc.contributor.authorBeureuther, A.
dc.contributor.authorNakamura, T.
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorSimon-Najasek, M.
dc.contributor.authorAltmann, Frank
dc.contributor.authorCroes, Kristof
dc.contributor.authorBoit, Christian
dc.date.accessioned2021-10-27T10:16:15Z
dc.date.available2021-10-27T10:16:15Z
dc.date.issued2019
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33129
dc.sourceIIOimport
dc.titleNon-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation
dc.typeJournal article
dc.contributor.imecauthorWu, Chen
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecWu, Chen::0000-0002-4636-8842
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage73
dc.source.endpage78
dc.source.journalMicroelectronics Reliability
dc.source.volume92
dc.identifier.urlhttps://doi.org/10.1016/j.microrel.2018.11.009
imec.availabilityPublished - imec


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