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Application of Cl2 for low temperature etch and epitaxy

dc.contributor.authorHikavyy, Andriy
dc.contributor.authorPorret, Clément
dc.contributor.authorRosseel, Erik
dc.contributor.authorMilenin, Alexey
dc.contributor.authorLoo, Roger
dc.date.accessioned2021-10-27T10:29:42Z
dc.date.available2021-10-27T10:29:42Z
dc.date.issued2019
dc.identifier.issn0268-1242
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33162
dc.sourceIIOimport
dc.titleApplication of Cl2 for low temperature etch and epitaxy
dc.typeJournal article
dc.contributor.imecauthorHikavyy, Andriy
dc.contributor.imecauthorPorret, Clément
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorMilenin, Alexey
dc.contributor.imecauthorLoo, Roger
dc.contributor.orcidimecHikavyy, Andriy::0000-0002-8201-075X
dc.contributor.orcidimecPorret, Clément::0000-0002-4561-348X
dc.contributor.orcidimecMilenin, Alexey::0000-0003-0747-0462
dc.contributor.orcidimecLoo, Roger::0000-0003-3513-6058
dc.source.peerreviewyes
dc.source.beginpage74003
dc.source.journalSemiconductor Science and Technology
dc.source.issue7
dc.source.volume34
dc.identifier.urlhttps://iopscience.iop.org/article/10.1088/1361-6641/aafc93
imec.availabilityPublished - imec


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