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Ultra-fine pitch 3D-stacked integrated circuits: technology, design enablement and application

dc.contributor.authorMilojevic, Dragomir
dc.contributor.authorAgrawal, Prashant
dc.contributor.authorRaghavan, Praveen
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorCatthoor, Francky
dc.contributor.authorVan der Perre, Liesbet
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorVaradarajan, Ravi
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T14:00:45Z
dc.date.available2021-10-27T14:00:45Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33590
dc.sourceIIOimport
dc.titleUltra-fine pitch 3D-stacked integrated circuits: technology, design enablement and application
dc.typeBook chapter
dc.contributor.imecauthorMilojevic, Dragomir
dc.contributor.imecauthorAgrawal, Prashant
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorCatthoor, Francky
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecCatthoor, Francky::0000-0002-3599-8515
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage21
dc.source.bookHandbook of 3D Integration - Vol.4: Design, Test and Thermal Management
dc.source.endpage40
dc.identifier.urlhttps://doi.org/10.1002/9783527697052.ch2
imec.availabilityPublished - imec
imec.internalnotesChapter 2


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