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Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip

dc.contributor.authorWei, Tiwei
dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.authorBaelmans, Tine
dc.date.accessioned2021-10-27T23:23:36Z
dc.date.available2021-10-27T23:23:36Z
dc.date.issued2019
dc.identifier.issn1359-4311
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34432
dc.sourceIIOimport
dc.titleExperimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip
dc.typeJournal article
dc.contributor.imecauthorWei, Tiwei
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage308
dc.source.endpage318
dc.source.journalApplied Thermal Engineering
dc.source.volume152
dc.identifier.urlhttps://www.sciencedirect.com/science/article/pii/S1359431118332885
imec.availabilityPublished - imec


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